Bio

An Experienced R&D Scientist, Application Specialist and Technology Manager with Great People Skills Extensive Backgrounds on Product Developments / Managements in Various Specialty Chemicals Areas - Novel Surface Finishes (EPIG, AgAu etc) for IC Substrate, High Speed, High Frequency Application - IC Substrate Packaging, Wafer Level Packaging - PCB Surface Finishes (ImSn, ImAg, OSP, ENIG, and ENEPIG) - PCB Metallization, Additive Plating - Connector Metal Finishes (Sn, Ni, Au, Ag, In, NiW, AgSn, NiP, Rh, Ru)