Bio

Vern is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the electronics industry for more than twenty-five years in areas related to both commercial and aerospace electronic product development and is active as an author and educator. Solberg holds several patents for IC packaging innovations including the multiple die and folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication.

Mr. Solberg has been involved with the training of both students and faculty members at the University of Wisconsin, School of Engineering in Milwaukee and Kansas State Universities Microelectronic Laboratory in Salina. Vern also participates in and supports several industry organizations including IPC, SMTA, IEEE and IMAPS.