Bio

* Extensive Technical background in Rigid and Flex Printed Circuit Board manufacturing processes and materials. * Extensive Technical background in Interconnects, Test sockets and Probe Cards. * Extensive Technical background in IC Packaging substrates and processes. * Strong management skills. Managed R&D, Process Engineering, Pilot Production, Chem. Lab, Reliability and Quality groups in the Electronics Industry. * Author/Co-Author of over 70 patents in different areas of the Electronics and Semiconductor Industries. * Extensive Technical knowledge on Failure Analysis for bare and Assembled PCB's. * Knowledge of Quality protocols: ISO-9001 and ISO-13485. * The key contributor in the Development of Chip Size Packaging (uBGA) which revolutionized the miniaturization in the Electronics Industry.