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Prasad Kodaypak

Director of Technical Solutions

Radisys Corporation

Country or State

United States

Bio

Accomplished Leader in Wireless Communications Industry. Technical Leadership and Management in Tier-1 Service Provider AT&T Labs and Tier-1 Infrastructure Vendor, Ericsson. O-RAN/3GPP/BBF/ITU-T/IEEE Standards Research, Global Collaboration and Partnership building Complex Large Scale Mobility Radio Access and Core Networking Platforms, End-to-End Network Services Design, Customer Focused, Product and Vendor Management, RFI/RFP/SoW process, Technical Contract Negotiation, Leading Proof of Concepts/ Lab/Field Integration Trials, Commercial Deployments and Innovation. Expertise: 5G-SA/NSA/LTE/4G/3G/2G Wireless and Optical Access Solutions, O-RAN/vRAN, CBRS FWA/ MSO's HFC-DOCSIS/FTTH-PON/SD-PON, Cellular IoT (LTE-M/NB-IoT)/LoRa/LPWAN, MCPTT Broadcast/Multicast, FirstNet, Regulatory, Global International Mobility Roaming Services, C-V2X, IMS Services, Messaging, KPI Metrics and Data Analytics, NFV/SDN/Containerization of Cloud Native Network Functions and Services Assurance. Senior Member, IEEE IEEE Communications Society-Invited Technical Program Committee Review Member for flagship IEEE Global Conferences (GLOBECOM/WCNC/ICC etc.), Magazines and Journals in broader aspects of Telecommunications Systems and Networks. Technical Panel and Speaking Engagements in various Industry Conferences/Trade Shows/Exhibitions/Forums. 95 Granted US Patents

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Current Position

Director of Technical Solutions at Radisys Corporation

Degrees

M.Sc Electrical Engineering (Research, Wireless Communications)

Skills