Bio

Mr. Ray Prasad is an inductee to the IPC Hall of Fame, the highest honor in our industry for his contribution to the electronics industry. He has more than 30 years of experience in all aspects of Surface Mount Technology (SMT) and teaches classes on these subjects across the globe as detailed on his website- www.rayprasad.com

As the Lead Engineer, he introduced SMT into the airplanes at Boeing and as SMT Program Manager, managed the global implementation of SMT at Intel.

Ray's expertise includes all areas of SMT including SMT, Fine pitch, ball grid array, and BTC. He is currently the Chairman of IPC 7095 on BGA, IPC 7093 on BTC and IPC 7530 on Reflow Profile Development and Past Chairman of IPC 782/7351 on land pattern design and IPC 786/J-STD-20/33 on baking and handling of moisture sensitive Plastic Packages.

In addition to authoring a textbook on surface mount technology used as a text book at leading US Universities, and translated into Chinese. Ray has published more than 100 papers and was the columnist for the SMT Magazine and served on its advisory board for over two decades.

He has helped many clients over the years in their process audits, on site classes on SMT Design and Manufacturing, legal disputes, has testified at trials, testified in depositions and prepared expert reports.

Ray is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel Achievement Award.

He received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science & Engineering and MBA from the University of California at Berkeley. He is a registered Professional Metallurgical Engineer.

Specialties: Printed Circuit Board design and assembly. Lead free, BGA, fine pitch and SMT, BTC and PoP