Bio

Solutions-oriented business development executive, focused on creating longterm, supply chain partnerships! EXPERTISE: Wafer Bumping, Wafer Level Chip Scale Packaging, Embedded Wafer Level BGA Wafer Ultra Thinning and Dicing Services SiP and Complex Multichip Packaging Turnkey Assembly & Test Business Development and Program Management Expertise Implantable Devices: Complex RF ASIC microelectronic assemblies, sensors, etc. Intra-Vascular Imaging Transducer assemblies MEMS Modules Traditional IC & Discrete Packaging Solutions Specialties: Solutions-oriented business development executive, focused on creating longterm, supply chain partnerships!