Bio

Printed circuit board subject matter expert with eighteen years of strong Electronics Industry experience and a heavy emphasis on materials, applications development, PWB manufacturing, industry standards and specifications, with design, assembly, and fabrication knowledge. Several years of experience managing quality oriented teams, with mechanical and electronic calibration knowledge, and direct relationships with all facets of the value chain. Passionate about learning, teaching, and all things PWB.

Active member of over thirty IPC standards development committees, including performance and design specifications (IPC-T-50, IPC-A-600/6012, IPC-6013, IPC-6018, IPC-2221/2222, IPC-2223, IPC-2228, Flexible Circuit Test Methods, IPC-4202, IPC-4203, IPC-4204). Member of the PERM Council (Lead-free Electronics Risk Management). Mentor in IPC's Emerging Engineer Program. Member of IPC's CCC (Committee Chairman Council) and IPC's TAEC (Technical Activities Executive Council). Member of ASQ, SMTA, IEEE, ASME, Marquis' Who's Who, and NextFlex, Corporate Member of High Density Packaging Users Group.

Chairman of IPC's 3-10 Printed Board Base Materials Committee, Vice-Chair of IPC's Flexible Circuit Test Methods committee. Co-Chair of IPC's Flexible Circuit Materials committee. Co-Chair of IPC-2223 Design for Flexible Printed Boards. 2023 IPC President's Award recipient.