Bio

- Principal Engineer at DataCenter Group of Intel Corporation, specialized in high speed interconnect.
- Elevated to IEEE Fellow in 2021
- Author of 12 IEEE refereed journal papers, 90+ external Conference papers, many Intel internal conference papers, and numerous Intel Internal design guides and documents.
- Holding 16 US patents, and several patent applications.
- Industry standard development
* IEEE P370 standard development chair: https://standards.ieee.org/develop/project/370.html
* IPC D24D Task Group co-chair.

- IEEE activities
* Chair of TAC (Technical Advisory Committee) of IEEE EMC Society. 2018, 2019, 2020
* Technical Paper Chair of IEEE international Symposium on EMC and SIPI, 2020, 2019, 2018.
* Technical Program Committee co-Chair of IEEE International Conference on Signal Integrity and Power Integrity: 2017, 2016, 2014.
* Technical achievement award of IEEE EMC Society, 2015
* IEEE Distinguished Lecturer, 2014-2015
* Technical Program Committee vice-chair of 2015 IEEE Symposium on EMC and SI.
* Chair of TC10 (Signal and Power Integrity Technical Committee) of IEEE EMC Society from 2012-2014.